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The desired property of gate and interconnection metallization is

This question was previously asked in
UGC NET Paper 2: Electronic Science 3rd Dec 2021 Shift 2
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  1. High resistivity
  2. Low resistivity
  3. Low conductivity
  4. Large stress

Answer (Detailed Solution Below)

Option 2 : Low resistivity
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UGC NET Paper 1: Held on 21st August 2024 Shift 1
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Detailed Solution

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Concept:

  • Gate and interconnection metallization controls the speed of the circuit by controlling the resistance of the interconnection lines.
  •  For high speed operation, such resistance should be as small as possible.
  • The gate and interconnection metallization also controls flat band voltage VFB, which is essential to maintain a flat band condition
  • The contact metallization gives electrically and mechanically stable ohmic contact having contact resistance negligibly small compared to the device
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